Hiromasa Ishikawa, Katsuhiko Sasaki and Ken-ichi Ohguchi: "Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity" Transactions of ASME,Journal of Electronic Packaging. 118. 164-169 (1996)
Hiromasa Ishikawa, Katsuhiko Sasaki and Ken-ichi Ohguchi: "Prediction of Fatigue Failure of 60Sn-40Pb Solder Using Constitutive Model for Cyclic Viscoplasticity" Transactions of ASME,Journal of Electronic Packaging. 118. 164-169 (1996)
复制标题
Hiromasa Ishikawa、Katsuhiko Sasaki 和 Ken-ichi Ohguchi：“使用循环粘塑性本构模型预测 60Sn-40Pb 焊料的疲劳失效”ASME 交易，电子封装杂志。
DOI：
--
复制
发表时间：
--
期刊：
影响因子：
--
通讯作者：
中科院分区：
文献类型：
--
作者：
