EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS
EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS
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电迁移对 Ni/Sn3.0Ag0.5Cu/Cu 倒装芯片焊点界面反应的影响
DOI：
10.3724/sp.j.1037.2011.00601
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发表时间：
2012-03
期刊：
影响因子：
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通讯作者：
Zhou Shaoming
中科院分区：
文献类型：
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作者：
Huang Mingliang;Chen Leida;Zhou Shaoming
研究了150℃、5.0×10~ 3A/cm 2电流密度下电迁移对Ni/Sn3.0Ag0.5Cu/Cu焊点界面反应的影响，并与150℃时效的焊点进行了对比，结果表明：（Cu，
The effect of electromigration(EM) on the interfacial reaction in Ni/Sn3.0Ag0.5Cu/Cu solder joints was investigated under a current density of 5.0×10~3 A/cm~2 at 150℃.All solder joints were aged at 150℃for comparison purpose.It has been found that the(Cu,