Piezoelectric behavior of wood under combined compression and vibration stresses -: I:: Relation between piezoelectric voltage and microscopic deformation of a Sitka spruce (Picea sitchensis Carr.)
Piezoelectric behavior of wood under combined compression and vibration stresses -: I:: Relation between piezoelectric voltage and microscopic deformation of a Sitka spruce (Picea sitchensis Carr.)
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DOI:
10.1007/bf00521871
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发表时间:
1998-01-01
影响因子:
2.9
通讯作者:
Ando, K
中科院分区:
文献类型:
--
作者:
Nakai, T;Igushi, N;Ando, K
This study investigated the relation between piezoelectric behavior and the deformation of trachieds in real time under combined compression and vibration stresses. Scanning electron microscope images were recorded directly into a video recorder. Two types of microscopic destruction were observed in the specimens. With the first type, although a small uprush around the boundary of the annual ring was observed, the specimens were broken only by shearing fracture in the 45 degrees direction. With the second type, the specimens were finally broken by shearing fracture after repeated buckling. In these cases the piezoelectric voltage increased almost linearly in the elastic region, proceeded to the maximal point, and then decreased gradually. Finally a clear peak appeared in the buckling and shearing fracture. There is a curved relation between the specific gravity and the piezoelectric parameter when the influence of voids is considered, and there is a linear relation between the dynamic Young's modulus and the piezoelectric parameter when the stress is considered.