A Hybrid Process for Printing Pure and High Conductivity Nanocrystalline Copper and Nickel on Flexible Polymeric Substrates
A Hybrid Process for Printing Pure and High Conductivity Nanocrystalline Copper and Nickel on Flexible Polymeric Substrates
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DOI：
10.1038/s41598-019-55640-7
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发表时间：
2019-12-13
影响因子：
4.6
通讯作者：
Minary-Jolandan, Majid
中科院分区：
文献类型：
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作者：
Bhuiyan, Md Emran Hossain;Behroozfar, Ali;Minary-Jolandan, Majid
在柔性基材上印刷功能器件需要印刷高导电率的金属图案。为了防止聚合物基材变形和损坏，金属图案的加工（印刷）和后加工（退火）温度必须低于基材的玻璃化转变温度。在此，演示了一种混合工艺，包括沉积牺牲毯薄膜，然后进行基于室内环境喷嘴的电沉积，以及随后蚀刻毯薄膜，以在柔性基材（PI 和 PET）上印刷纯纳米晶金属（Ni 和 Cu）图案。显微镜和光谱分析表明，打印的金属是纳米晶、固体、无孔隙、杂质含量低。无需任何热退火即可获得接近本体的电阻率（类似于2倍）。机械表征证实了熔敷金属具有优异的循环强度，在高循环弯曲下降解有限。演示了包括射频识别 (RFID) 标签、加热器、应变计和温度传感器在内的多种设备。
Printing functional devices on flexible substrates requires printing of high conductivity metallic patterns. To prevent deformation and damage of the polymeric substrate, the processing (printing) and post-processing (annealing) temperature of the metal patterns must be lower than the glass transition temperature of the substrate. Here, a hybrid process including deposition of a sacrificial blanket thin film, followed by room environment nozzle-based electrodeposition, and subsequent etching of the blanket film is demonstrated to print pure and nanocrystalline metallic (Ni and Cu) patterns on flexible substrates (PI and PET). Microscopy and spectroscopy showed that the printed metal is nanocrystalline, solid with no porosity and with low impurities. Electrical resistivity close to the bulk (similar to 2-time) was obtained without any thermal annealing. Mechanical characterization confirmed excellent cyclic strength of the deposited metal, with limited degradation under high cyclic flexure. Several devices including radio frequency identification (RFID) tag, heater, strain gauge, and temperature sensor are demonstrated.