Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers
Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers
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DOI：
10.1016/j.microrel.2011.07.095
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发表时间：
2012-01-01
影响因子：
1.6
通讯作者：
Mao, Dali
中科院分区：
文献类型：
--
作者：
Ni, Mingzhi;Li, Ming;Mao, Dali
环氧模塑料(EMC)与预镀PD引线框(PD PPF‘s)之间的粘合力较弱，经常会导致脱层，降低集成电路的可靠性。本文报道了一种利用电镀异形镍层显著提高EMC与PdPPF之间结合力的实用方法。纽扣剪切试验表明，EMC与三种不同形状的PPF之间的粘结力分别比常规PPF高100%、160%、169%。表面粗糙度增加引起的机械连锁效应是粘结性能提高和失效模式由粘结失效向粘结失效转变的主要原因。(C)2011爱思唯尔有限公司。保留所有权利。
The weak adhesion between the Epoxy Molding Compound (EMC) and Pd Preplated leadframes (Pd PPF's) often causes delaminations and reduces the reliability of integrated circuit. This paper reports on a practical method of dramatically improving the adhesion between EMC and Pd PPF's using electroplating of shaped nickel layers. Button shear tests indicate that the adhesions between the EMC and three different shaped PPF's are 100%, 160%, 169% higher than that of conventional PPFs. The mechanical interlocking effect caused by increased surface roughness is the major reason for the improved adhesion as well as for the failure mode transition from adhesive failure to cohesive failure. (C) 2011 Elsevier Ltd. All rights reserved.