Quantification of the mechanical strength of thermally reduced graphene oxide layers on flexible substrates
Quantification of the mechanical strength of thermally reduced graphene oxide layers on flexible substrates
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DOI：
10.1016/j.engfracmech.2021.107525
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发表时间：
2021-01
影响因子：
5.4
通讯作者：
Maysam Rezaee;Li-Chih Tsai;A. Elyasigorji;M. Haider;A. Yazdi;N. Salowitz
中科院分区：
文献类型：
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作者：
Maysam Rezaee;Li-Chih Tsai;A. Elyasigorji;M. Haider;A. Yazdi;N. Salowitz
本文提出了一种方法，使用受控剥离试验来表征基于rGO 1的器械的失效模式。用图像处理技术分析在测试期间从基底脱离的rGO颗粒，并将结果用于创建量化内聚和粘附失效能量的数学模型。基于从基底脱离的rGO颗粒的百分比计算部分失效能量，使得脱离百分比越高，失效能量越低。将该模型应用于对用不同GO浓度、制剂和处理制成的样品的一系列测试。
This paper proposes a method to characterize the failure modes of rGO1-based devices using a controlled peel test. Analysis of the detached rGO particles from the substrate during testing was performed with an image processing technique and results were used to create a mathematical model quantifying the cohesion and adhesion failure energies. Partial failure energies were calculated based on percentage of rGO particles detached from the substrate so that the higher detachment percentage the lower failure energies. The model was applied to an array of tests on samples made with different GO concentrations, preparations, and treatments.