DUCTILE-REGIME MACHINING OF GERMANIUM AND SILICON
DUCTILE-REGIME MACHINING OF GERMANIUM AND SILICON
复制标题
DOI：
10.1111/j.1151-2916.1990.tb05142.x
复制
发表时间：
1990-04-01
影响因子：
3.9
通讯作者：
SCATTERGOOD, RO
中科院分区：
文献类型：
--
作者：
BLAKE, PN;SCATTERGOOD, RO
研究了使用单点金刚石车削进行锗和硅的精密加工。特别注意的是所谓的韧性制度，其中光学质量的表面光洁度可以直接在脆性材料上加工。一种新的中断切削试验和一个新的加工过程模型被用来测量临界深度参数实验。该参数控制沿沿着刀尖从塑性流动到断裂的过渡。临界深度参数可用于提供对各种加工参数（如刀具前角或刀具间隙角）的影响的物理洞察。由于刀具几何形状、加工参数和材料响应之间的复杂相互作用，即使在达到延性状态条件时，也会通过断裂发生大部分材料去除。
Precision machining of germanium and silicon was studied using single‐point diamond turning. Special attention was directed to the so‐called ductile regime wherein optical quality surface finishes can be machined directly on brittle materials. A novel interrupted‐cutting test and a new model of the machining process were used to measure a critical‐depth parameter experimentally. This parameter governs the transition from plastic flow to fracture along the tool nose. The critical‐depth parameter can be used to provide physical insight into the effect of various machining parameters such as tool rake angle or tool clearnace angle. Because of a complex interplay between tool geometry, machining parameters, and material response, a large fraction of material removal occurs by fracture even when ductile‐regime conditions are achieved.