Microstructure of Interfacial Region Between Cold-Sprayed Copper Coating and AlN Substrate Coated with Sputtered Titanium and Copper
Microstructure of Interfacial Region Between Cold-Sprayed Copper Coating and AlN Substrate Coated with Sputtered Titanium and Copper
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DOI：
10.1007/s11666-010-9522-z
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发表时间：
2011-03
影响因子：
3.1
通讯作者：
H. Nakano;M. Yamada;M. Fukumoto;E. Yamaguchi
中科院分区：
文献类型：
--
作者：
H. Nakano;M. Yamada;M. Fukumoto;E. Yamaguchi
