The effect of residual stress on whisker reinforcements in SiCw-Al2O3 composites during cooling

The effect of residual stress on whisker reinforcements in SiCw-Al2O3 composites during cooling
复制标题

SiCw-Al2O3复合材料冷却过程中残余应力对晶须增强体的影响

DOI:
10.1016/j.jallcom.2017.07.192
复制
发表时间:
2017-11
影响因子:
6.2
通讯作者:
Zhipeng Xie
Zhipeng Xie
中科院分区:
材料科学2区
文献类型:
--
作者:
Weiwei Wu;Jingya Gui;Tianbin Zhu;Zhipeng Xie

文献摘要

参考文献

被引文献

相似文献

研究了293 ~ 77 K时残余应力对sicw - al2o3复合材料晶须增强的影响。77 K时sicw - al2o3复合材料的断裂韧性比293 K时提高了约26%。计算得到77 K时SiC晶须的压缩应力为~ 600 MPa,并通过原位曼光谱和荧光光谱证实了局部应力的分布。测定了r曲线行为和裂纹张开位移曲线,比较了不同温度下残余应力对裂纹桥接的影响。实验结果证实,在77 K的残余应力作用下,sicw - al2o3复合材料的裂纹桥接能力增强,是一种很有前景的低温材料。
The effect of residual stress on whisker reinforcements in SiCw-Al2O3composites from 293 K to 77 K was investigated. The fracture toughness of SiCw-Al2O3composites measured at 77 K was ∼26% higher than that at 293 K. The calculated compressive stress of SiC whiskers at 77 K was ∼600 MPa, and the local stress distribution is demonstrated byin-situRaman spectra and fluorescence spectra.R-Curve behaviors and crack opening displacement profiles were determined to compare the effect of residual stress on crack bridging at different temperatures. The experimental results verified that crack bridging was enhanced by residual stress at 77 K, which made the SiCw-Al2O3composite to be a promising material for cryogenic applications.
石墨烯纳米片对GNPs/Al2O3复合材料低温力学性能的增强作用
DOI: 10.1016/j.jallcom.2016.08.314
发表时间: 2017-01
影响因子: 6.2
作者:
Weiwei Wu;Jingya Gui;Wei Sai;Zhipeng Xie
通讯作者: Zhipeng Xie
DOI: 10.1111/j.1151-2916.1987.tb04982.x
发表时间: 1987-04
影响因子: 3.9
作者:
P. Swanson;C. J. Fairbanks;B. Lawn;Y. Mai;B. Hockey
通讯作者: P. Swanson;C. J. Fairbanks;B. Lawn;Y. Mai;B. Hockey
DOI: 10.1016/j.jeurceramsoc.2004.09.021
发表时间: 2005-11-01
影响因子: 5.7
作者:
Nakao, W;Ono, M;Ando, K
通讯作者: Ando, K
DOI: 10.1016/j.engfracmech.2004.07.003
发表时间: 2005-03
影响因子: 5.4
作者:
T. Fett;A. B. K. Njiwa;J. Rödel
通讯作者: T. Fett;A. B. K. Njiwa;J. Rödel
DOI: 10.1016/j.scriptamat.2011.03.032
发表时间: 2011-07
期刊: Scripta Materialia
影响因子: 6
作者:
W. Yao;J. Liu;T. Holland;Lin Huang;Y. Xiong;J. Schoenung;A. Mukherjee
通讯作者: W. Yao;J. Liu;T. Holland;Lin Huang;Y. Xiong;J. Schoenung;A. Mukherjee