Particle-free semiconductor cutting using the water jet guided laser
Particle-free semiconductor cutting using the water jet guided laser
复制标题
使用水射流引导激光进行无颗粒半导体切割
DOI：
10.1117/12.585748
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发表时间：
2005
影响因子：
--
通讯作者：
J. Manley
中科院分区：
文献类型：
--
作者：
D. Perrottet;A. Spiegel;F. Wagner;Roy Housh;B. Richerzhagen;J. Manley
多年来，由于半导体的脆性和对清洁度的严格要求，晶圆切割对基于激光的切割技术提出了挑战。由于传统的激光切割会产生强烈的热影响区和大量的颗粒，因此磨料锯切是目前半导体晶片切割的标准工艺。然而，磨料锯切不再能满足新兴类型的半导体器件的需求，如基于薄晶片和化合物半导体的器件。本文研究了新的分离方法。水射流引导激光器是一种相对较新的技术，其不仅提供显著减少的热影响区，而且提供更清洁的晶片表面。这首先是由于水射流，其在激光脉冲之间冷却材料并去除由激光烧蚀产生的大量熔融材料。然而，该系统最近进行了升级，增加了一个设备，在整个切割过程中用一层控制良好的薄水膜覆盖整个晶片表面。因此，所产生的少量颗粒保持悬浮，并且不会存款在晶片表面上。
For many years, wafer cutting has posed a challenge to laser-based cutting techniques because of the brittle nature of semiconductors and the exacting requirements for cleanliness. Since conventional laser cutting generates a strong heat-affected zone and a large amount of particles, abrasive sawing is currently the standard process for semiconductor wafer dicing. However, abrasive sawing can no longer fulfill the demands of new, emerging types of semiconductor devices like those based on thin wafers and compound semiconductors. New separation methods are investigated here. The water jet guided laser is a relatively recent technology that offers not only a significantly reduced heat-affected zone but also a cleaner wafer surface. This is due, first, to the water jet, which cools the material between the laser pulses and removes a significant amount of molten material generated by laser ablation. However, the system has recently been upgraded by adding a device that covers the entire wafer surface with a well-controlled thin water film throughout the cutting process. The few generated particles are thus kept in suspension and will not deposit on the wafer surface.