Vacancy-Induced Plastic Deformation in Electrodeposited Copper Films
Vacancy-Induced Plastic Deformation in Electrodeposited Copper Films
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电解铜膜中空位引起的塑性变形
DOI：
10.1149/1.2429033
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
D. N. Buckley
中科院分区：
文献类型：
--
作者：
S. Nakahara;Shafaat Ahmed;Tanjim T. Ahmed;D. N. Buckley
利用过量空位向晶界迁移的扩散方程，计算了室温时效过程中多晶铜薄膜中产生的拉伸应力。这一理论是基于这样一个假设：由于铜薄膜晶界处多余空位的到来而产生的自由体积会立即消除，并且这种作用会在薄膜平面上引入双轴拉伸应力。拉伸应力随时效时间、晶粒尺寸和多余空位浓度的变化而变化，发现拉伸应力可以超过铜的屈服应力。这一结果表明，在室温时效过程中，电沉积铜膜可能发生塑性变形，这与实验观察结果一致。
A tensile stress developed in polycrystalline copper films during room-temperature aging was computed using a diffusion equation for excess vacancies migrating to the grain boundaries. This theory is based on an assumption that a free volume created by the arrival of excess vacancies at the grain boundaries of thin copper films is instantly eliminated and this action introduces a biaxial tensile stress in the plane of the film. The tensile stress was calculated as a function of aging time, grain size, and excess vacancy concentration and it was found that it could exceed the yield stress of copper. This result suggests that plastic deformation could occur in electrodeposited copper films during room-temperature aging, consistent with experimental observations.