Boosting the oxygen evolution activity of copper foam containing trace Ni by intentionally supplementing Fe and forming nanowires in anodization
Boosting the oxygen evolution activity of copper foam containing trace Ni by intentionally supplementing Fe and forming nanowires in anodization
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DOI：
10.1016/j.electacta.2020.137170
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发表时间：
2020-12-20
影响因子：
6.6
通讯作者：
Noda, Suguru
中科院分区：
文献类型：
--
作者：
Anantharaj, Sengeni;Sugime, Hisashi;Noda, Suguru
析氧反应（OER）是实现酸碱电解水高效制氢的瓶颈。由Ni和Co氢氧化物电催化的碱性OER是公知的，其在添加Fe时显示出意想不到的增强。我们发现，商业上获得的含有痕量Ni（类似于1.5重量%）的Cu泡沫在阳极氧化时形成Cu（OH）（2）-CuO纳米线，可想象形成Ni（OH）（2），并且经历其OER活性的显著增强。当在阳极氧化期间有意补充足够量的Fe时，其OER活性进一步提高。具体地，作为在KOH中和在Fe补充的KOH中的阳极化的组合结果，在50 mA cm（-2）下的过电位降低了153 mV。这种激活还通过将Tafel斜率降低100 mV dec（-1）来改善OER的动力学。利用这些，这里已经表明，中等活性的OER催化剂，即，在泡沫铜阳极氧化时形成的Cu（OH）（2）-CuO/Cu，仅通过利用其已经含有的微量Ni和有意补充足够量的Fe，就可以转变成高活性催化剂。(C)2020爱思唯尔有限公司保留所有权利。
Oxygen evolution reaction (OER) is the bottleneck for realizing energy-efficient hydrogen production through water electrolysis in both acid and alkali. Alkaline OER electrocatalyzed by Ni and Co hydroxides are well known which showed unexpected enhancement with the addition of Fe. We found that the commercially procured Cu foam containing trace amount of Ni (similar to 1.5 wt.%) upon anodization formed Cu(OH)(2)-CuO nanowires with conceivable formation of Ni(OH)(2) and experienced a notable enhancement in its OER activity. When sufficient amount of Fe was intentionally supplemented during anodization, OER activity of the same was further improved. Specifically, as a combined result of anodization in KOH and in Fe supplemented KOH, overpotential at 50 mA cm(-2) was lowered by 153 mV. Such an activation also improved the kinetics of OER by lowering the Tafel slope by 100 mV dec(-1). With these, it has been shown here that a moderately active OER catalyst i.e., Cu(OH)(2)-CuO/Cu formed upon the anodization of Cu foam can be turned into a highly active catalyst just by utilizing the trace Ni that it already contains and intentionally supplementing sufficient amount of Fe. (C) 2020 Elsevier Ltd. All rights reserved.