Influence of Oxidation of Copper on Shear Bond Strength to an Acrylic Resin Using an Organic Sulfur Compound
Influence of Oxidation of Copper on Shear Bond Strength to an Acrylic Resin Using an Organic Sulfur Compound
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DOI：
10.3390/ma13092092
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发表时间：
2020-05-01
期刊：
影响因子：
3.4
通讯作者：
Matsumura, Hideo
中科院分区：
文献类型：
--
作者：
Hiraba, Haruto;Koizumi, Hiroyasu;Matsumura, Hideo
本研究的目的是阐明铜表面由Cu或Cu2O变为CuO对树脂与有机硫化合物结合强度的影响。铜的盘状试样（n = 44）是湿磨的。一半的样品在电炉中400℃加热4分钟（HT：加热）。一半的标本未加热（UH：未加热）。标本进一步分为两组。每组用6-甲基丙烯酰氧己基2-硫脲嘧啶-5-羧酸酯（MTU-6）或未引物（n = 11）引物。对剪切粘结强度试验结果进行统计分析，并用光学显微镜对粘结区破坏模式进行分类。用x射线光电子能谱（XPS）对两种样品表面（UH或HT）进行了化学分析。未加热Cu （28.3 MPa）的结合强度大于加热Cu （19.1 MPa）。加热后的Cu （4.1 MPa）比未加热时的Cu （2.3 MPa）具有更高的结合强度。脱粘面观察结果显示，所有试件中只有UH-MTU-6组出现粘接和内聚双重破坏。XPS结果表明，高温作用下，铜表面由Cu或Cu2O变为CuO。这些结果证实，在使用有机硫化合物粘附贵金属合金时，必须注意其所含的氧化铜。
The aim of this study was to clarify the influence of the copper surfaces changed from Cu or Cu2O to CuO on the bonding strength of resin with organic sulfur compounds. The disk-shaped specimens (n = 44) of copper were wet-ground. Half of the specimens were heated at 400 degrees C for 4 min in an electric furnace (HT: heated). Half of the specimens were not heated (UH: unheated). The specimens were further divided into two groups. Each group was primed by 6-methacryloyloxyhexyl 2-thiouracil-5-carboxylate (MTU-6) or unprimed (n = 11). A statistical analysis of the results of shear bond strength testing was performed, and the failure mode of the bonded areas was classified with an optical microscope. Two types of specimen surface (UH or HT) were analyzed chemically using X-ray photoelectron spectroscopy (XPS). When primed with MTU-6, unheated Cu (28.3 MPa) showed greater bond strength than heated (19.1 MPa). When unprimed, heated Cu (4.1 MPa) showed greater bond strength than unheated (2.3 MPa). The results of the debonded surfaces observation showed that only the UH-MTU-6 group demonstrated a combination of adhesive and cohesive failures in all specimens. The XPS results showed that the surface of copper changed from Cu or Cu2O to CuO when HT. These results confirmed that it is necessary to take care of the copper oxide contained in noble metal alloys when using organic sulfur compounds for adhesion.