EFFECTS OF SURFACE MORPHOLOGY ON THERMAL CONTACT RESISTANCE
EFFECTS OF SURFACE MORPHOLOGY ON THERMAL CONTACT RESISTANCE
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DOI：
10.2298/tsci11s1033h
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发表时间：
2011
期刊：
影响因子：
1.7
通讯作者：
Haiming Huang;Xiaoliang Xu
中科院分区：
文献类型：
--
作者：
Haiming Huang;Xiaoliang Xu
接触热阻是航空航天工业、核反应堆和电子设备中普遍存在的问题。提出了一种新的测量薄膜光滑表面与金属试样粗糙表面接触热阻的方法。采用有限元法研究了表面形貌对接触热阻的影响，并通过回归方法确定了接触表面的温度。研究结果表明，接触表面温度随着表面粗糙度平均高度的增加而线性下降，随着非接触面积与名义接触面积之比的增加而非线性下降。另一方面，接触热阻随着表面粗糙度的平均高度的增加而线性增加。此外，接触热阻随着非接触面积与标称接触面积之比的增加而以非线性方式增加。当热通量传导通过两个相邻的接触表面时，在接触区域处出现附加的接触热阻（TCR）。电阻温度系数与温度、压力、表面形貌和热流方向的关系是一个复杂的非线性问题。TCR是实际热设计中的一个关键因素，它与热分析中的不确定性因素有关。TCR分析和测定是当代文献中的一个热门话题，涉及模拟和实验研究。在这方面，Rao（1）报道了一种涉及数值传热和参数识别的新方法，而阿马拉等人（2）使用随机接触分布并使用3-D模型计算TCR。Shen等人（3）的方法利用不同的拓扑形状来模拟接触表面，并得到一个近似公式。此外，杰克逊模型（4）将尺度相关表面特征和性质的影响与TCR联系起来。Chen等人（5）使用差示法测量了石墨烯和二氧化硅之间的TCR。Wu等人（6）发现，通过添加适当数量的适当厚度的夹层，可以有效地提高多孔材料的热阻。
The thermal contact resistance is common in aerospace industry, nuclear reactors and electronic equipments. The work addresses a new scheme for determining the thermal contact resistance between a smooth surface of a film and a rough surface of a metal specimen. The finite element method was used as a tool to explore the surface morphology effect on the thermal contact resistance while the temperature of the contact surface was determined by a regression method. According to the results developed, the temperature on the contact surfaces linearly drops with the increasing average height of surface roughness and nonlinearly drops with the increasing ratio between non-contact area and nominal contact area. On the other hand, the thermal contact resistance increases linearly with increases in the average height of the surface roughness. What's more, the thermal contact resistance increases in a non-linear manner as the ratio of the non-contact area to the nominal contact area is increasing. When a heat flux conducts through two adjacent contact surfaces, an additional thermal contact resistance (TCR) appears at the contact region. The relationship of TCR with temperature, pressure, surface morphology and direction of heat flow is a complex and non- linear problem. TCR is a key factor in actual thermal design and relays to the uncertainty factors in thermal analysis. TCR analysis and determination is a hot topic in the contemporary literature addressing both simulation and experimental studies. In this context, Rao (1) reported a new method involving numerical heat transfer and parameter identification, while Amara et al. (2) used a random contact distribution and calculated TCR with a 3-D model. The approach of Shen et al. (3) utilizes different topological shapes to simulate the contact surfaces and yielded an approximate formula. Further, the Jackson's model (4) relates the effects of the scale dependent surface features and properties with the TCR. Chen et al. (5) measured TCR between grapheme and silicon dioxide by using a differential method. Wu et al. (6) found that the thermal resistances of porous materials could be effectively improved by adding appropriate number of interlayer of appropriate thickness.