3D printed high density, reversible, chip-to-chip microfluidic interconnects
3D printed high density, reversible, chip-to-chip microfluidic interconnects
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DOI：
10.1039/c7lc01113j
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发表时间：
2018-02-21
期刊：
影响因子：
6.1
通讯作者：
Nordin, Gregory P.
中科院分区：
文献类型：
--
作者：
Gong, Hua;Woolley, Adam T.;Nordin, Gregory P.
我们在使3D打印微流体化方面的最新进展[Gong等人，Lab Chip，2016，16，2450; Gong等人，Lab Chip，2017，17，2899]提供了制造高度集成的芯片的机会，这些芯片的尺寸只有几毫米。对于这样的小芯片，需要一种互连方法来提供必要的世界到芯片的试剂和气动连接。在本文中，我们介绍了简单的集成微垫片（西姆斯）和控制压缩集成微垫片（CCIMs）连接一个小的设备芯片到一个更大的接口芯片，实现世界到芯片的连接。西姆斯或CCIM直接3D打印作为设备芯片的一部分，因此不需要额外的材料或组件来连接到更大的3D打印接口芯片。我们展示了西姆斯和CCIM的11 x 11阵列中的121个芯片到芯片互连，面密度为每mm（2）53个互连，并表明它们能够承受50 psi的流体压力。我们通过对器械进行100次测试而未发生密封失效，进一步证明了其可重复使用性。缩放实验表明，20 × 20互连阵列是可行的，CCIM面密度可以增加到88个互连/mm（2）。然后，我们通过使用具有28个芯片到世界互连的互连芯片来测试9 x5阵列中的45个3D打印阀门，展示了空间分布的离散CCIM的实用性。每个瓣膜的直径仅为300 μ m（3D打印瓣膜的最小报告）。每排5个阀门至少测试10000次驱动，其中一排测试1000000次驱动。在所有情况下，没有阀门故障的迹象，CCIM互连证明了使用单个接口芯片测试一系列阀门阵列芯片的有效方法。
Our latest developments in miniaturizing 3D printed microfluidics [Gong et al., Lab Chip, 2016, 16, 2450; Gong et al., Lab Chip, 2017, 17, 2899] offer the opportunity to fabricate highly integrated chips that measure only a few mm on a side. For such small chips, an interconnection method is needed to provide the necessary world-to-chip reagent and pneumatic connections. In this paper, we introduce simple integrated microgaskets (SIMs) and controlled-compression integrated microgaskets (CCIMs) to connect a small device chip to a larger interface chip that implements world-to-chip connections. SIMs or CCIMs are directly 3D printed as part of the device chip, and therefore no additional materials or components are required to make the connection to the larger 3D printed interface chip. We demonstrate 121 chip-to-chip interconnections in an 11 x 11 array for both SIMs and CCIMs with an areal density of 53 interconnections per mm(2) and show that they withstand fluid pressures of 50 psi. We further demonstrate their reusability by testing the devices 100 times without seal failure. Scaling experiments show that 20 x 20 interconnection arrays are feasible and that the CCIM areal density can be increased to 88 interconnections per mm(2). We then show the utility of spatially distributed discrete CCIMs by using an interconnection chip with 28 chip-to-world interconnects to test 45 3D printed valves in a 9 x 5 array. Each valve is only 300 mu m in diameter (the smallest yet reported for 3D printed valves). Every row of 5 valves is tested to at least 10000 actuations, with one row tested to 1000000 actuations. In all cases, there is no sign of valve failure, and the CCIM interconnections prove an effective means of using a single interface chip to test a series of valve array chips.