Shear Creep Deformation of the Super Alloy Single Crystal CMSX‐4 at High Temperatures and Low Stresses
Shear Creep Deformation of the Super Alloy Single Crystal CMSX‐4 at High Temperatures and Low Stresses
复制标题
高温低应力下超级合金单晶CMSX-4的剪切蠕变变形
DOI：
10.1002/mawe.200390095
复制
发表时间：
2003
影响因子：
1.1
通讯作者：
G. Eggeler
中科院分区：
文献类型：
--
作者：
M. Kamaraj;K. Serin;M. Kolbe;K. Neuking;G. Eggeler
本文研究了单晶高温合金CMSX-4在950 ~ 1100 °C温度和80 ~ 155 MPa剪切应力下的剪切蠕变行为。 双剪切蠕变试验技术用于研究由特定晶体学剪切平面和特定晶体学剪切方向定义的四个特定宏观晶体学剪切系统（研究的系统：{001}<110>、{100}<010>、{011}<01 - 1>和{111}<01 - 1>）的剪切蠕变行为。剪切蠕变行为进行了分析，在个人的蠕变曲线的形状和应力和温度的依赖性的二次剪切蠕变速率。单个蠕变曲线的特征通常在于显著的主蠕变范围，其中蠕变速率降低多达三个数量级。没有观察到急剧的蠕变速率最小值。第二蠕变范围开始于0.02量级的剪切应力，随后是延伸超过0.1量级的剪切应变范围的第二蠕变范围。剪切蠕变速率在蠕变后期没有明显的增加。诺顿图产生的幂律应力指数范围为5.5至9.7。的二次蠕变速率的温度依赖性是一个Arrhenius型和549和690 kJ/mol之间的表观活化能被发现。有一个明确的影响，晶体学剪切蠕变速率，不同的宏观晶体剪切系统之间的变化，这种效果随温度的升高而降低。在本研究中获得的剪切蠕变结果进行了讨论，从单轴测试的结果，并在光的基本微观变形过程。
In the present paper we investigate the shear creep behavior of the single crystal super alloy CMSX‐4 at temperatures between 950 and 1100 °C and shear stresses ranging from 80 to 155 MPa. A double shear creep test technique is used to study the shear creep behavior of four specific macroscopic crystallographic shear systems defined by a specific crystallographic shear plane and a specific crystallographic shear direction (systems investigated: {001}<110>, {100}<010>, {011}<01‐1>, and {111}<01‐1>). The shear creep behavior is analyzed in terms of the shape of individual creep curves and in terms of the stress and the temperature dependence of the secondary shear creep rate. Individual creep curves are generally characterized by a pronounced primary creep range where creep rates decrease by up to three orders of magnitude. A sharp creep rate minimum is not observed. The secondary creep range starts at shear stresses of the order of 0.02 and is followed by a secondary creep range which extends over shear strain ranges of the order of 0.1. No pronounced increase of shear creep rate in the later stages of creep is observed. Norton plots yield power law stress exponents ranging from 5.5 to 9.7. The temperature dependence of the secondary creep rate is of an Arrhenius type and apparent activation energies between 549 and 690 kJ/mol were found. There is a clear influence of crystallography on shear creep rates, which vary between different macroscopic crystallographic shear systems; this effect decreases with increasing temperature. The shear creep results obtained in the present study are discussed in the light of results from uniaxial testing and in the light of underlying microscopic deformation processes.