The use of time resolved aerosol assisted chemical vapour deposition in mapping metal oxide thin film growth and fine tuning functional properties

The use of time resolved aerosol assisted chemical vapour deposition in mapping metal oxide thin film growth and fine tuning functional properties
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DOI:
10.1039/c4ta05922k
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发表时间:
2015-02
影响因子:
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通讯作者:
N. Chadwick;S. Sathasivam;Salem M Bawaked;M. Mokhtar;S. Al‐Thabaiti;S. Basahel;I. Parkin;C. Carmalt
N. Chadwick;S. Sathasivam;Salem M Bawaked;M. Mokhtar;S. Al‐Thabaiti;S. Basahel;I. Parkin;C. Carmalt
中科院分区:
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文献类型:
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作者:
N. Chadwick;S. Sathasivam;Salem M Bawaked;M. Mokhtar;S. Al‐Thabaiti;S. Basahel;I. Parkin;C. Carmalt

文献摘要

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通过对薄膜进行时间分辨分析,首次能够通过气溶胶辅助化学气相沉积来分析薄膜的生长和随时间的变化。这种方法还允许调整材料的功能属性。本文研究了一种疏水性的高度光催化的二氧化钛/二氧化锡体系,该体系表现出SnO2的表面分离,从而形成了一种新的天然异质结电荷转移系统。用多种方法对时间分辨样品进行了研究。用X射线衍射仪(XRD)、X射线光电子能谱(XPS)、扫描电子显微镜(SEM)和紫外-可见吸收光谱(UV-Vis)对薄膜进行了表征。通过测定紫外光照射前后的光活性和水接触角来研究其功能性质。在沉积序列的不同时间产生具有代表性的样品,使得晶体结构、原子的相对浓度和表面形态的变化与功能性质的变化内在地联系在一起。
Time resolved analysis of a thin film has allowed, for the first time, analysis of how thin film growth occurs and changes over time by aerosol assisted CVD. This method has also allowed tuning of the materials' functional properties. In this report a hydrophobic and highly photocatalytic TiO2/SnO2 system is studied, which exhibits surface segregation of SnO2 and thus the novel formation of a natural hetero-junction charge transfer system. The time resolved samples were investigated by a variety of methods. The films were characterised by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM) and Ultraviolet-visible absorption spectroscopy (UV-vis). Functional properties were investigated by photo-activity measurements and water contact angles before and after UV irradiation. The generation of representative samples at different times during the deposition sequence permitted changes in crystal structure, relative concentrations of atoms, and surface morphology to be linked intrinsically to changes in functional properties.