Effects of Cu and Ni additions to eutectic Pb–Sn solders on Au embrittlement of solder interconnections
Effects of Cu and Ni additions to eutectic Pb–Sn solders on Au embrittlement of solder interconnections
复制标题
共晶 Pb-Sn 焊料中添加 Cu 和 Ni 对焊料互连 Au 脆化的影响
DOI：
10.1557/jmr.2001.0175
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发表时间：
2001
影响因子：
2.7
通讯作者：
Yong
中科院分区：
文献类型：
--
作者：
Jong;Jong;Yong;Yong
采用球剪试验方法研究了Cu和Ni添加量对固态时效过程中共晶Sn-Pb焊料互连金脆化的影响。在时效处理过程中，钎料基体内部形成了Au-Sn-Cu或Au-Sn-Ni相的含au三元金属间化合物。含2.9 wt% Cu的钎料在150℃时效处理200 h后，断裂能基本保持不变，表明可以通过在钎料基体内形成三元金属间相来抑制Au的脆化。
Effects Cu and Ni additions on Au embrittlement of eutectic Sn–Pb solder interconnections during a solid-state aging treatment were evaluated using a ball shear testing method. The addition resulted in a formation of Au-containing ternary intermetallic compounds, either Au–Sn–Cu or Au–Sn–Ni phase, inside the solder matrix during aging treatment. The fracture energy of the solder interconnection containing 2.9 wt% Cu remained almost the same up to 200 h of aging treatment at 150 °C, demonstrating the possibility of suppressing the Au embrittlement by forming ternary intermetallic phases inside the solder matrix.