Laser Sintering of Silver Nanoparticles for Electronic Use
Laser Sintering of Silver Nanoparticles for Electronic Use
复制标题
电子用银纳米颗粒的激光烧结
DOI：
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发表时间：
2010
期刊：
影响因子：
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通讯作者：
H. Saito
中科院分区：
文献类型：
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作者：
K. Maekawa;K. Yamasaki;T. Niizeki;M. Mita;Y. Matsuba;N. Terada;H. Saito
银 NanoPaste® 具有平均直径 5 nm 的银纳米颗粒，涂覆在聚酰亚胺基板或铜基板上，并用 CW 激光器成功烧结。可见激光从浆料表面快速金属化使得溶剂和分散剂难以蒸发，导致烧结不充分且孔隙较大。相比之下，在浆料中吸收很少的近红外激光首先加热基板，然后将金属化发展到浆料表面，因此很容易蒸发，使结构更加致密。在激光烧结Ag薄膜和基底的界面处没有观察到剥离。其粘合强度几乎等于炉烧结样品的粘合强度。
The silver NanoPaste® having silver nanoparticles with 5 nm in average diameter, coated either on a polyimide substrate or a copper one, is successfully sintered with CW lasers. A rapid metallization from the paste surface with the visible laser makes the evaporation of solvent and dispersant difficult, resulting in an insufficient sintering with large pores. In contrast, the near-infrared laser with a little absorption in the paste heats the substrate first, and then develops metallization up to the paste surface, so that an easy evaporation makes the structure denser. No peeling was observed at the interface of the laser-sintered Ag film and the substrates. Its adhesive strength is nearly equal to that of the furnace-sintered sample.