A Novel Submicron Polymer Re-Distribution Layer Technology for Advanced InFO Packaging
A Novel Submicron Polymer Re-Distribution Layer Technology for Advanced InFO Packaging
复制标题
用于先进 InFO 封装的新型亚微米聚合物重新分布层技术
DOI：
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发表时间：
2018
期刊：
影响因子：
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通讯作者：
Douglas Yu
中科院分区：
文献类型：
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作者：
H. Pu;H. Kuo;C. S. Liu;Douglas Yu
随着人工智能（ai）等高性能计算（HPC）应用的兴起，集成不同功能的先进多芯片封装可能是一种快速上市且具有成本效益的解决方案，而不是SOC。因此，需要更多的I/O芯片之间的通信来实现先进的封装。为了满足这一需求，模具之间大量的注册布线导致了工业界对模具到模具再分配层（RDL）的小型化的不断推动。本文演示了InFO超高密度（UHD） RDL技术[1]，RDL线宽可达亚微米范围（<1um）。该技术可以满足行业趋势的需求。InFO UHD RDL技术的特点是电气性能，例如，过链连续性，RDL梳状/弯曲Rs，线对线泄漏电流，以及最终的可靠性测试，如电迁移（EM），应力迁移（SM），击穿电压（Vbd），随时间介质击穿（TDDB）等。经过工艺优化后，电学测试数据表明，通过链连续性、RDL梳状/蜿蜒Rs和泄漏电流的收率为>99%。初步可靠性测试表明，从EM、SM、Vbd、TDDB等方面均表现出良好的可靠性。本文还将讨论包级可靠性测试和结果。未来的潜在挑战将在基本技术限制方面进行讨论，如进一步缩小RDL线宽和通径，基于模拟和理论预测，以及解决这些问题的可能方法。
From high-performance computing (HPC) applications such as Artificial Intelligence (A.I.) rising, advanced multi-chip packaging to integrate different functions could be a fast time-to-market and cost effective solution instead of SOC. Accordingly, more I/O die to die communications for advanced packaging is a need. To fulfill this demand, large number in registered routing lines between dies lead a constant drive for miniaturization for die to die Redistributed Layer (RDL) among industry. In this article, InFO Ultra-High-Density (UHD) RDL technology [1] is demonstrated, with RDL line-width down to submicron range (<1um). This technology can empower the needs with industry trend. The InFO UHD RDL technology is characterized by electrical performances, e.g., via-chain continuity, RDL Comb/Meander Rs, line-to-line leakage current, and eventually reliability testing such as electro-migration (EM), stress migration (SM), breakdown voltage (Vbd), Time-Dependent-Dielectric Breakdown (TDDB), etc. After process optimization, the electrical test data demonstrate >99% yields from via-chain continuity, RDL Comb/Meander Rs and leakage current. Initial reliability testing shows good performance from EM, SM, Vbd, TDDB, etc. Package-level reliability test and results will also be addressed in this article. The potential challenges ahead will be discussed in terms of fundamental technical confinements as further scaling-down in RDL line-width and via, based on simulated and theoretical predictions, and possible approaches to resolve them.