A NOVEL RESONANT SILICON ACCELEROMETER IN BULK-MICROMACHINING TECHNOLOGY
A NOVEL RESONANT SILICON ACCELEROMETER IN BULK-MICROMACHINING TECHNOLOGY
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DOI：
10.1016/0924-4247(94)00887-n
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发表时间：
1995-01-01
影响因子：
4.6
通讯作者：
ESTEVE, J
中科院分区：
文献类型：
--
作者：
BURRER, C;ESTEVE, J
报道了一种采用体微机械加工技术的谐振式加速度计的制作和性能测试。该装置由一个硅地震质量悬挂两个铰链从一侧。在它们之间，负载敏感的硅梁被定位，夹持到主体和质量。该梁是电热驱动和感测压电。采用双扩散电化学蚀刻停止工艺以制造传感器结构，允许梁在平面外负载下的伸长和压缩，具有单晶片体微机械制造工艺。初始器件测量结果表明，在90 kHz的光束振荡频率下，对平面外加速度的灵敏度为200 Hz g（-1）。成功验证了传感器在带有外部自动增益控制电路的闭环电路中的操作。
The fabrication and characterization of a resonant accelerometer made in bulk-micromachining technology are reported. The device consists of a silicon seismic mass suspended by two hinges from one side. Between them, a load sensitive silicon beam is located, clamped to the bulk and to the mass. The beam is driven electrothermally and sensed piezoresistively. A double-diffusion electrochemical etch stop process was employed in order to fabricate a sensor structure, permitting elongation and compression of the beam under an out-of-plane load, with a single wafer bulk-micromachining fabrication process. Initial device measurements show a sensitivity of 200 Hz g(-1) to out-of-plane accelerations at a beam oscillation frequency of 90 kHz. Operation of the sensor in a closed-loop circuit with an external automatic gain control circuit was successfully verified.