Investigation of soy protein-Kymene® adhesive systems for wood composites
Investigation of soy protein-Kymene® adhesive systems for wood composites
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DOI：
10.1007/s11746-004-0928-1
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发表时间：
2004-05-01
影响因子：
2
通讯作者：
Geng, XL
中科院分区：
文献类型：
--
作者：
Li, KC;Peshkova, S;Geng, XL
本研究探讨了一种新的粘合剂体系，该体系由大豆分离蛋白（SPI）和Kymene（R）557 H（简称Kymene）（一种商业纸张湿强剂）组成，该体系通过将SPI和Kymene混合制备。与SPI-Kymene粘合剂制剂粘合的木材复合材料的剪切强度与商业酚醛树脂粘合的剪切强度相当或更高。用这种新型胶粘剂体系粘接的木质复合材料具有很高的耐水性，即使在沸水试验后仍能保持较高的强度。新的粘合剂系统是无甲醛，易于使用，环保。Kymene被提议用作SPI-Kymene粘合剂中的固化剂。
This study investigated a new adhesive system, consisting of soy protein isolate (SPI) and Kymene(R) 557H (simply called Kymene) (a commercial wet-strength agent for paper), that was prepared by mixing SPI and Kymene. Wood composites bonded with SPI-Kymene adhesive preparations had shear strengths comparable to or higher than those bonded with commercial phenol formaldehyde resins. Wood composites bonded with the new adhesive system had high water resistance and retained relatively high strength even after they had undergone a boiling-water test. The new adhesive system is formaldehyde-free, easy to use, and environmentally friendly. Kymene was proposed to serve as a curing agent in SPI-Kymene adhesives.