Scanning Acoustic Microscopy Package Fingerprint Extraction for Integrate Circuit Hardware Assurance
Scanning Acoustic Microscopy Package Fingerprint Extraction for Integrate Circuit Hardware Assurance
复制标题
用于集成电路硬件保证的扫描声学显微镜封装指纹提取
DOI：
10.31399/asm.cp.istfa2021p0059
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发表时间：
2021
期刊：
影响因子：
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通讯作者：
Navid Asadizanjani
中科院分区：
文献类型：
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作者：
Daniel Johnson;Po;Chengjie Xi;Navid Asadizanjani
在美国最近通过的解决芯片短缺的立法和资金的帮助下，半导体行业的供应链正在经历芯片开发方面的痛苦增长和进步。然而，它也有一些缺点，其中之一是在整个过程中保持对制造质量的控制的挑战之一。因此，硬件安全的物理检查是确保半导体器件的必要的。本文综述了各种物理检测方法，认为扫描声学显微镜(SAM)是最大限度地减少造假可能性的理想物理检测方法，可能是大规模检测造假的可行方案。
The supply chain of the semiconductor industry is experiencing painful growth and advancement in chip development with the help of recently passed U.S legislation and funding to address a chip shortage. However, it is not without some drawbacks, one of which is the challenge of maintaining control over the manufacturing quality throughout the entire process. As a result of this, physical inspection for hardware security is a necessity to assure the semiconductor devices. In this paper, various physical inspection methods are reviewed and scanning acoustic microscopy (SAM) is proved to be the ideal physical inspection method to minimize the possibility of counterfeits which might be the feasible solution in detecting counterfeits on a large scale.