Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics
Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics
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DOI：
10.1073/pnas.1806640115
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发表时间：
2018-07-31
影响因子：
11.1
通讯作者：
Lee, Chi Hwan
中科院分区：
文献类型：
--
作者：
Wie, Dae Seung;Zhang, Yue;Lee, Chi Hwan
从其制造晶片转移印刷薄膜纳米电子器件通常需要在牺牲晶片上进行化学蚀刻，但也受到缺陷的限制，产量低。在这里，我们介绍了一种晶圆可回收，环境友好的转印工艺，该工艺能够以无缺陷的方式将高性能薄膜纳米电子器件从其制造晶圆中分离出来，从而实现晶圆的多次重复使用。通过在室温下的水环境中的可控开裂现象，能够实现界面分层。物理释放的薄膜纳米电子器件可以粘贴到任意感兴趣的地方，从而赋予特定的表面所需的附加电子功能。系统的实验，理论和计算研究揭示了潜在的力学机制，并在可扩展性，可控性和再现性方面指导转印工艺的可制造性。
Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.