High-Resolution, High-Aspect-Ratio Printed and Plated Metal Conductors Utilizing Roll-to-Roll Microscale UV Imprinting with Prototype Imprinting Stamps
High-Resolution, High-Aspect-Ratio Printed and Plated Metal Conductors Utilizing Roll-to-Roll Microscale UV Imprinting with Prototype Imprinting Stamps
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DOI：
10.1021/acs.iecr.8b03619
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发表时间：
2018-12-05
影响因子：
4.2
通讯作者：
Francis, Lorraine F.
中科院分区：
文献类型：
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作者：
Jochem, Krystopher S.;Suszynski, Wieslaw J.;Francis, Lorraine F.
通过卷对卷工艺将微米尺度的高纵横比特征压印到可紫外光固化的聚合物中，并用于在塑料基板上创建高载流导电网络。开发了一种邮票制造方法，用于制造低成本，快速生产的卷对卷印记邮票，可以模具从3 μ m到1 mm宽的特征。将25 μ m厚的紫外光固化树脂层置换成凸起特征，形成50 μ m高的孤立凸起特征。通过将银墨水印刷到与通道相连的容器中，并允许毛细管流涂覆镀层，然后填充通道，利用带有印迹毛细管通道的基材形成导电体。该导体具有高分辨率，每长度高宽电阻，易于集成到网络中。这种卷对卷压印工艺可生产高分辨率印刷电子产品。英吉利海峡。铜的化学比（类似于5:1高：宽），低为高通量制造高分辨率印刷电子产品提供了基础。
Micron-scale, high-aspect-ratio features were imprinted by a roll-to-roll process into a UV-curable polymer and used to create high-current-carrying conductive networks on plastic substrates. A stamp fabrication method was developed to create low-cost, rapidly produced roll-to-roll imprinting stamps, which can mold features from 3 mu m to 1 mm wide. Isolated raised features 50 mu m high were molded from a 25-mu m-thick layer of UV-curable resin by displacing resin into raised features in the stamp. Substrates with imprinted capillary channels were used to form electrical conductors by printing a silver ink into reservoirs connected to the channels and allowing capillary flow to coat plating then filled the channels. The conductors demonstrate high resolution, high aspect resistance per length, and easy integration into networks. This roll-to-roll imprinting process throughput manufacturing of high-resolution printed electronics. the channel. Copper electroless ratio (similar to 5:1 height:width), low provides a foundation for high-throughput manufacturing of high-resolution printed electronics.