Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging
Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging
复制标题
电子封装三维热导结构的热机械拓扑优化
DOI：
10.1115/1.4053948
复制
发表时间：
2022
影响因子：
1.6
通讯作者：
Lee, Jaeho
中科院分区：
文献类型：
--
作者：
Farzinazar, Shiva;Ren, Zongqing;Lim, Jungyun;Kim, Jae Choon;Lee, Jaeho
异构且复杂的电子封装可能需要独特的热机械结构来提供最佳的热引导。特别地，当热源和散热器未对准且不允许直接路径时，提供均匀散热的传统热管理方法可能不合适。在这里，我们提出了一种拓扑优化方法，以找到导热且机械稳定的结构，以在各种热源-散热器布置下实现最佳热引导。为了利用这些功能，我们考虑了复杂的热引导场景和三维 (3D) 蛇形结构，以 30 度到 90 度的角角传输热量。热目标函数被定义为最小化温度梯度，而机械目标函数被定义为在体积约束下最大化刚度。我们的模拟表明，与相同体积分数下未进行拓扑优化的参考结构相比，优化后的结构的热阻低于 32%，刚度高于 43%。热阻的显着差异归因于尖角附近的热死体积。作为概念验证实验，我们使用选择性激光熔化技术创建了 3D 热引导结构，并使用红外热成像技术表征了其热性能。实验表明，热优化结构的热阻比参考结构低29%。这些结果展示了拓扑优化和 3D 制造的独特能力，可实现异构系统的最佳热引导并推进电子封装的最先进水平。
Heterogeneous and complex electronic packages may require unique thermomechanical structures to provide optimal heat guiding. In particular, when a heat source and a heat sink are not aligned and do not allow a direct path, conventional thermal management methods providing uniform heat dissipation may not be appropriate. Here we present a topology optimization method to find thermally conductive and mechanically stable structures for optimal heat guiding under various heat source-sink arrangements. To exploit the capabilities, we consider complex heat guiding scenarios and three-dimensional (3D) serpentine structures to carry the heat with corner angles ranging from 30 deg to 90 deg. While the thermal objective function is defined to minimize the temperature gradient, the mechanical objective function is defined to maximize the stiffness with a volume constraint. Our simulations show that the optimized structures can have a thermal resistance of less than 32% and stiffness greater than 43% compared to reference structures with no topology optimization at an identical volume fraction. The significant difference in thermal resistance is attributed to a thermally dead volume near the sharp corners. As a proof-of-concept experiment, we have created 3D heat guiding structures using a selective laser melting technique and characterized their thermal properties using an infrared thermography technique. The experiment shows the thermal resistance of the thermally optimized structure is 29% less than that of the reference structure. These results present the unique capabilities of topology optimization and 3D manufacturing in enabling optimal heat guiding for heterogeneous systems and advancing the state-of-the-art in electronics packaging.