UV-LIGA: a promising and low-cost variant for microsystem technology
UV-LIGA: a promising and low-cost variant for microsystem technology
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DOI：
10.1109/commad.1998.791668
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发表时间：
1998-12
期刊：
影响因子：
--
通讯作者：
W. Qu;C. Wenzel;A. Jahn;D. Zeidler
中科院分区：
文献类型：
--
作者：
W. Qu;C. Wenzel;A. Jahn;D. Zeidler
描述了一种低成本表面微结构化技术，并提供了其最近应用的示例。 UV-LIGA 新技术将非常厚的光刻胶的深度紫外光刻图案化和结构材料电沉积到图案化光刻胶模具中相结合。紫外光刻和电沉积都不需要任何昂贵或特殊的设备。通过将UV-LIGA工艺与牺牲层技术相结合，可以获得具有高纵横比的可移动三维微结构。作为微系统中先进应用的一个例子，我们介绍了使用钛作为牺牲层、镍作为结构材料制造 3D 加速度计。
A low-cost surface microstructuring technique is described and examples provided of its recent application. The new technology, UV-LIGA combines depth UV lithographic patterning of very thick photoresists and electrodepositing of structural materials into the patterned resist moulds. Both UV lithography and electrodeposition do not need any expensive or special equipment. Movable three dimensional microstructures with a high aspect ratio can be obtained by combining the UV-LIGA process with a sacrificial layer technique. As an example of the advanced application in microsystems, fabrication of 3D accelerometers has been presented, using titanium as a sacrificial layer and nickel as the structural material.