DUV Optical Wafer Inspection System for 65-nm Technology Node
DUV Optical Wafer Inspection System for 65-nm Technology Node
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适用于 65 纳米技术节点的 DUV 光学晶圆检测系统
DOI：
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发表时间：
2005
期刊：
影响因子：
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通讯作者：
Y. Miyazaki
中科院分区：
文献类型：
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作者：
Kenji Watanabe;S. Maeda;T. Funakoshi;Y. Miyazaki
综述：先进半导体器件的小型化趋势正在加速。在此背景下，晶片检测系统所需的性能不仅仅是更高的灵敏度，还包括适应新材料，如ArF光致抗蚀剂、Cu布线和低k材料，以及300 mm晶片生产线的更高吞吐量。为了开发满足上述要求的系统，日立高新技术公司开始与东京精密公司联合开发高性能DUV（深紫外线）光学晶圆检测系统，2003年，Ltd.该系统目前已投放市场。通过采用具有比常规使用的白色光和UV（紫外）光更短的波长的DUV光作为光源，该系统利用更强的照明来获得更小的检查像素尺寸和更高的检测灵敏度。它还实现了通过采用世界上最快的图像处理设备之一，比传统系统高出数倍的吞吐量。因此，该系统能够科普65 nm和更小的节点。Kenji Watanabe，Dr. Eng. Shunji Maeda，Dr. Eng. Tomohiro Funakoshi Yoko宫崎
OVERVIEW: The trend of miniaturization in advanced semiconductor devices is accelerating. Against this background, the performance required of a wafer inspection system extends beyond simply greater sensitivity to include accommodating new materials such as ArF photoresist, Cu wiring, and low-k materials as well as higher throughput for 300-mm wafer production lines. With the aim of developing a system that meets the requirements outlined above, Hitachi-High Technologies Corporation began joint development of the high-performance DUV (deep ultraviolet) optical wafer inspection system with TOKYO SEIMITSU Co., Ltd. in 2003. That system is now on the market. By employing DUV light, which has a shorter wavelength than the conventionally used white light and UV (ultraviolet) light, as the light source, this system makes use of the more intense illumination to attain a smaller inspection pixel size and higher detection sensitivity. It furthermore achieves a throughput that is several times higher than that of conventional systems by employing one of the world’s fastest image processing devices. This system is thus able to cope with nodes of 65 nm and smaller. Kenji Watanabe, Dr. Eng. Shunji Maeda, Dr. Eng. Tomohiro Funakoshi Yoko Miyazaki