Study on the relationship between crystal plane orientation and strength of electrolytic copper foil
Study on the relationship between crystal plane orientation and strength of electrolytic copper foil
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电解铜箔晶面取向与强度关系的研究
DOI：
10.1016/j.jallcom.2021.161044
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发表时间：
2021-12
影响因子：
6.2
通讯作者：
Tang Yiping
中科院分区：
文献类型：
--
作者：
Zhang Jianli;Chen Haibo;Fan Binfeng;Shan Haipeng;Chen Qiang;Jiang Chenhao;Hou Guangya;Tang Yiping
对于锂离子电池（LIB）来说，集流体是装载电极材料不可缺少的部件。选取不同抗拉强度的电解铜箔，研究铜箔的强化机理。通过细化晶粒，强化铜箔的晶体取向，可以显着提高抗拉强度。对于普通强度铜箔，晶体取向为（200）晶面，平均晶粒尺寸为 1.428 µm。对于高强度和超强度铜，晶体取向均为（220）晶面，平均晶粒尺寸为1.09 µm和862 nm。此外，通过表征铜箔的位错密度，研究了织构对强度的影响机制。通过它可以观察晶粒内部因残余内应力释放而产生的位错和亚结构，并在拉伸过程中阻碍晶粒的变形。
For lithium-ion batteries (LIBs), the current collectors are indispensable components for loading electrode materials. The electrolytic copper foils with different tensile strength were selected to study the strengthening mechanism of copper foil. Through refining crystal grains and strengthen the crystal orientation of copper foils, the tensile strength can be considerably improved. For normal strength copper foil, the crystal orientation is (200) plane and the average grain size is 1.428 µm. For high strength and super strength copper, the crystal orientation are both (220) plane, and the average grain sizes are 1.09 µm and 862 nm. Moreover, the influence mechanism of texture to strength was studied by characterizing the dislocation density of the copper foils. Through which, the dislocations and substructures inside the crystal grains that produced by the release of residual internal stress can be observed, and the deformation of the crystal grains can be hindered during a stretch process.
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影响因子：
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