HBT Modeling

HBT Modeling
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DOI:
10.1109/mmm.2008.915366
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发表时间:
2008-04
影响因子:
3.6
通讯作者:
J. McMacken;S. Nedeljkovic;J. Gering;D. Halchin
J. McMacken;S. Nedeljkovic;J. Gering;D. Halchin
中科院分区:
计算机科学3区
文献类型:
--
作者:
J. McMacken;S. Nedeljkovic;J. Gering;D. Halchin

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III-V族异质结双极晶体管(HBT)相对于其常规硅表兄弟具有若干优点。其中包括:(1)更薄的基极和更低的基极电阻,这产生更高的增益和fmax;(2)高击穿电压;(3)低寄生效应;(4)高功率密度。薄基极(较高fT)、低基极电阻(较高fmax)和低寄生效应的组合尤其使HBT成为高频应用的合适选择。
III-V heterojunction bipolar transistors (HBTs) enjoy several advantages over their conventional silicon cousins. These include: (1) a thinner base and lower base resistance which yields higher gain and fmax; (2) high breakdown voltage; (3) low parasitics; (4) high power density. The combination of a thin base (higher fT), low base resistance (higher fmax), and low parasitics in particular make HBTs a suitable choice for high- frequency applications.