Evaluation of Atomic Layer Stacking Structure and Curie Temperature of Magnetic Films for Thermally Assisted Recording Media
Evaluation of Atomic Layer Stacking Structure and Curie Temperature of Magnetic Films for Thermally Assisted Recording Media
复制标题
热辅助记录介质磁性薄膜的原子层堆叠结构和居里温度评价
DOI:
10.1109/tmag.2013.2285286
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发表时间:
2014
影响因子:
2.1
通讯作者:
Shintaro Hinata and Migaku Takahashi
中科院分区:
文献类型:
--
作者:
Shin Saito;Shintaro Hinata and Migaku Takahashi
Thermally assisted recording system is a promising candidate to overcome the trilemma of perpendicular magnetic recording hard disk drive development. In this paper, we introduce our current research about evaluation for the media material. In-plane X-ray diffraction technique is effective to evaluate atomic layer stacking structure of (111)-oriented face-centered cubic, c-plane-oriented hexagonal closed packed (hcp), and their intermediate structure with stacking faults of CoPt alloy thin film. Analytical results of Co50Pt50-based thin film shows that changing the valence electron number closer to 9 can effectively reduce the stacking fault. In practical, perfect hcp atomic layer stacking can be achieved by substituting Pt (group 10) with Rh (group 9). High-angle annular dark field of scanning transmission electron microscopy with probe diameter of 1 Å can effectively observe composition modulated atomic layer stacking with the super-lattice diffraction in Co-based alloy films. In practical, for Co80M20 (M: Ir, Pt) thin film sputtered under high substrate temperature, the irregular or alternately layered structure of M rich and M poor layer can be observed directly. To evaluate Curie temperature (TC), which is an important physical property of thermally assisted media, conduction electron spin-dependent scattering should be the focus. Fitting dielectric spectra for MnSb thin film with TC ~ 320°C measured with the ellipsometry and analyzing the Drude's term, temperature dependence of resistivity and scattering time at around TC was confirmed.