Pulse Plating of Copper onto Gas Diffusion Layers for the Electroreduction of Carbon Dioxide
Pulse Plating of Copper onto Gas Diffusion Layers for the Electroreduction of Carbon Dioxide
复制标题
用于二氧化碳电解还原的气体扩散层上脉冲镀铜
DOI:
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发表时间:
2018
期刊:
影响因子:
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通讯作者:
F. Brushett
中科院分区:
文献类型:
--
作者:
S. Sen;McLain E. Leonard;R. Radhakrishnan;S. Snyder;B. Skinn;Dan Wang;Timothy D. Hall;E. Taylor;F. Brushett
This paper discusses a pulse electroplating method for preparing copper (Cu)-coated gas diffusion electrodes (GDEs) for the electrochemical conversion of carbon dioxide (CO_2) to hydrocarbons such as ethylene. Ionomer coating and air-plasma surface pre-treatments were explored as means of hydrophilizing the carbon surface to enable adhesion of electrodeposited material. The pulsed-current electrodeposition method used successfully generated copper and copper oxide micro- and nano-particles on the prepared surfaces. Copper(I) species identified on the ionomer-treated GDEs are presumed to be highly active for the selective generation of ethylene as compared to other gaseous byproducts of CO_2 reduction. Conversely, copper catalysts deposited onto plasma-treated GDEs were found to have poor activity for hydrocarbon production, likely due to substantial metallic character. Of note, plasma treatment of an ionomer-treated GDE after copper plating yielded further improvements in catalytic activity and durability towards ethylene production.
影响因子:
16.6
作者:
Mistry H;Varela AS;Bonifacio CS;Zegkinoglou I;Sinev I;Choi YW;Kisslinger K;Stach EA;Yang JC;Strasser P;Cuenya BR
通讯作者:
Cuenya BR