Silver nanosintering: a lead-free alternative to soldering
Silver nanosintering: a lead-free alternative to soldering
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DOI：
10.1007/s00339-008-4807-5
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发表时间：
2008-11
期刊：
影响因子：
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通讯作者：
M. Maruyama;Ryozo Matsubayashi;H. Iwakuro;S. Isoda;T. Komatsu
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文献类型：
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作者：
M. Maruyama;Ryozo Matsubayashi;H. Iwakuro;S. Isoda;T. Komatsu
我们建议使用无铅银浆来替代电子产品中使用的高温富铅焊料。这里测试的浆料含有少量溶剂，但主要由银粉和醇盐钝化的银纳米颗粒组成，加热时会发生纳米烧结。该浆料用于在 350°C、氮气环境下、无外部压力的情况下将硅二极管芯片连接至铜基体。由此产生的二极管封装的电性能和热性能与铅焊点的封装相当。机械强度也与铅接头相当。这些特性使这种纳米银焊膏成为第一个可行的无铅焊料替代品。
We propose a lead-free silver paste as a replacement for a high-temperature lead-rich solder used for electronics. The pastes tested here contain a small amount of solvent, but primarily consist of silver powder and alkoxide-passivated silver nanoparticles that undergo nanosintering when heated. The pastes were used to connect silicon diode chips to copper bases at 350°C in nitrogen ambient without external pressure. The resulting diode packages had electrical and thermal properties about equal to those with lead-solder joints. The mechanical strengths also were comparable to the lead joint. These properties make this nanosilver paste the first viable lead-free alternative to a lead solder.