Inductive Thermal Effect on Thermoplastic Nanocomposites with Magnetic Nanoparticles for Induced-Healing, Bonding and Debonding On-Demand Applications
Inductive Thermal Effect on Thermoplastic Nanocomposites with Magnetic Nanoparticles for Induced-Healing, Bonding and Debonding On-Demand Applications
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DOI：
10.3390/jcs7020074
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发表时间：
2023-02-01
影响因子：
3.3
通讯作者：
Charitidis, Costas
中科院分区：
文献类型：
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作者：
Kanidi, Maria;Loura, Niki;Charitidis, Costas
在这项研究中，纳米复合材料增强磁性纳米粒子的加热能力进行了研究，通过感应加热。将聚丙烯（PP）、热塑性聚氨酯（TPU）、聚酰胺（PA 12）和聚醚酮酮（PEKK）的热塑性（TP）基质与2.5-10重量%的聚乙烯（PE）共混，铁氧化物基磁性纳米颗粒（MNP）使用双螺杆挤出系统。通过3D打印和注射成型制备了一系列的圆形试样。使用带有螺线管感应线圈的射频（RF）发生器，检查了作为暴露时间、频率和功率函数的加热能力。所有纳米复合材料呈现出与MNP浓度成比例的温度增加，作为在磁场中暴露时间的函数。具有较高浓度的MNP的纳米复合材料呈现出温度的快速升高，导致在大多数试验中聚合物基体熔融。RF发生器的操作参数，例如输入功率和频率，显著影响试样的加热能力，更高的输入功率和更高的频率，并促进所有评估的纳米复合材料的温度快速升高，从而实现诱导愈合和按需粘合/脱粘应用。
In this study, the heating capacity of nanocomposite materials enhanced with magnetic nanoparticles was investigated through induction heating. Thermoplastic (TP) matrices of polypropylene (PP), thermoplastic polyurethane (TPU), polyamide (PA12), and polyetherketoneketone (PEKK) were compounded with 2.5-10 wt.% iron oxide-based magnetic nanoparticles (MNPs) using a twin-screw extrusion system. Disk-shape specimens were prepared by 3D printing and injection molding. The heating capacity was examined as a function of exposure time, frequency, and power using a radio frequency (RF) generator with a solenoid inductor coil. All nanocomposite materials presented a temperature increase proportional to the MNPs' concentration as a function of the exposure time in the magnetic field. The nanocomposites with a higher concentration of MNPs presented a rapid increase in temperature, resulting in polymer matrix melting in most of the trials. The operational parameters of the RF generator, such as the input power and the frequency, significantly affect the heating capacity of the specimens, higher input power, and higher frequencies and promote the rapid increase in temperature for all assessed nanocomposites, enabling induced-healing and bonding/debonding on-demand applications.