Investigation of Anodic Gas Film Behavior in Hall-Heroult Cell Using Low Temperature Electrolyte
Investigation of Anodic Gas Film Behavior in Hall-Heroult Cell Using Low Temperature Electrolyte
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DOI：
10.1007/s11663-013-9885-x
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发表时间：
2013-10-01
影响因子：
3
通讯作者：
Morsi, Yosry S.
中科院分区：
文献类型：
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作者：
Alam, Morshed;Yang, William;Morsi, Yosry S.
建立了一个新颖的四分之一比例的Hall-Heroult槽低温电解模型，研究了水平阳极表面下电解气泡的形成、合并和运动。首次将几何相似和动力相似原理应用于该模型电解槽的研制。使用0.28M CuSO 4 + 20%H2SO4水溶液作为电解质。类似于Hall-Heroult电池，铜（Cu）沉积在阴极处，并且在阳极下方产生氧（O-2）气泡。利用高速摄像机观察了阳极下气泡的产生机理、发展、聚结和分离。结果表明，在整个阳极表面下均匀地产生电解气泡，并通过气体扩散和聚结生长。随着电流密度（CD）和阳极倾斜角度的增加，阳极表面下的气泡速度增加。气泡层厚度和气泡尺寸随阳极倾角的增大而减小。阳极下的气泡覆盖率也随着阳极倾角的增加而降低，但被发现对CD的变化不敏感。最后，计算的气泡阻力被发现随着阳极角度的增加而减小。(C)矿物、金属和材料协会和ASM国际2013
A novel one-fourth scale low temperature electrolytic model of the Hall-Heroult cell was constructed to investigate the electrolytic bubble formation, coalescence, and movement under the horizontal anode surface. The principles of geometric and dynamic similarities were applied in developing this model electrolytic cell for the first time. A 0.28 M aqueous CuSO4 + 20 pct H2SO4 solution was used as the electrolyte. Analogous to the Hall-Heroult cell, copper (Cu) was deposited at the cathode and oxygen (O-2) bubbles were generated underneath the anode. The bubble generation mechanism, development, coalescence, and detachment underneath the anode were observed using a high speed camera. It was found that electrolytic bubbles were generated uniformly under the entire anode surface and grew through gas diffusion and coalescence. With increasing current density (CD) and anode inclination angle to the horizontal, bubble velocity increased underneath the anode surface. Moreover, the bubble layer thickness and bubble sizes decreased with an increase in anode inclination angle. Bubble coverage under the anode also decreased with increasing anode inclination angle, but was found to be insensitive to the change in CD. Finally, the calculated bubble resistance was found to decrease with increasing anode angle. (C) The Minerals, Metals & Materials Society and ASM International 2013