Polymer deformation and filling modes during microembossing
Polymer deformation and filling modes during microembossing
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DOI：
10.1088/0960-1317/14/12/005
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发表时间：
2004-12-01
影响因子：
2.3
通讯作者：
King, WP
中科院分区：
文献类型：
--
作者：
Rowland, HD;King, WP
这项工作研究了在具有足够厚度的聚合物薄膜的玻璃化转变温度(T-g)附近的加工温度下，热压微制造过程中聚合物变形的初始阶段，以使聚合物流动不受供应限制。通过使用不同宽度的印章几何形状以及不同的时间和温度的印记条件来调节聚合物的粘度，可以观察到聚合物流动的几个阶段。实验考察了影响空洞填充现象的条件，包括表观聚合物粘度。印有高度和宽度为4微米、周期为30微米、50微米和100微米的周期性脊纹的邮票，在T-g-10度C<；T-g+20度C的聚甲基丙烯酸甲酯薄膜上压印沟槽。时间、温度和载荷等印迹参数与复制聚合物形状、高度和印迹面积相关。用原子力显微镜测量聚合物复制品，并用扫描电子显微镜检查。聚合物粘度的空腔尺寸和温度依赖性对热压微制造中聚合物的变形性质有很大影响，在合理的工艺设计中必须加以考虑。
This work investigates the initial stages of polymer deformation during hot embossing micro-manufacturing at processing temperatures near the glass transition temperature (T-g) of polymer films having sufficient thickness such that polymer flow is not supply limited. Several stages of polymer flow can be observed by employing stamp geometries of various widths and varying imprint conditions of time and temperature to modulate polymer viscosity. Experiments investigate conditions affecting cavity filling phenomena, including apparent polymer viscosity. Stamps with periodic ridges of height and width 4 mum and periodicity 30, 50 and 100 mum emboss trenches into polymethyl methacrylate films at T-g - 10degreesC < T-emboss < T-g + 20degreesC. Imprint parameters of time, temperature and load are correlated with replicated polymer shape, height and imprinted area. Polymer replicates are measured by atomic force microscopy and inspected by scanning electron microscopy. Cavity size and the temperature dependence of polymer viscosity significantly influence the nature of polymer deformation in hot embossing micro-manufacturing and must be accounted for in rational process design.