On the cooling of natural-air-cooled electronic equipment casings (Proposal of a practical formula for thermal design)
On the cooling of natural-air-cooled electronic equipment casings (Proposal of a practical formula for thermal design)
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论自然风冷电子设备外壳的冷却（热设计实用公式的提出）
DOI：
10.1299/kikaib.51.1684
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发表时间：
1985
期刊：
影响因子：
--
通讯作者：
T. Sasaki
中科院分区：
文献类型：
--
作者：
M. Ishizuka;Y. Miyazaki;T. Sasaki
本文给出了电路板和电源按标准布置的自然风冷电子设备机壳热设计的一个简单公式。该公式以简化形式表示空冷系统，并充分考虑了烟囱效应、气流阻力、自然对流传递等因素，符合实用公式的要求。应用该公式对两个实际使用的标准布置电子设备机柜的温升进行了预测，并给出了一个模型实例。通过该公式得到的预测温升值误差很小，基于实验结果的实际值只有10%。
This paper presents a simple formula for thermal designing of natural-air-cooled electronic equipment casings with standard arrangement for circuit boards and power supplies. The formula meets the requirements as a practical formula, since it represents the air-cooling system in its simplified form with due regard to such factors as the stack effects, air Flow resistance, natural convective transfer and so on. The formula was applied to predict temperature rise for two practically used electronic equipment cabinets with standard arrangements and a modeling case. The predicted temperature rise values, obtained through the formula, caused very slight errors, with only 10 percent in the actual values based upon experiment results.