Effect of surface morphology and crystal orientations on fracture strength of thin film (110) single crystal silicon
Effect of surface morphology and crystal orientations on fracture strength of thin film (110) single crystal silicon
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DOI：
10.1109/transducers.2013.6627175
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发表时间：
2013-06
期刊：
影响因子：
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通讯作者：
A. Uesugi;Y. Hirai;K. Sugano;T. Tsuchiya;O. Tabata
中科院分区：
文献类型：
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作者：
A. Uesugi;Y. Hirai;K. Sugano;T. Tsuchiya;O. Tabata
本文报道了表面损伤和晶体取向对单晶硅断裂强度的影响。对来自（110）SOI晶片的九种类型的试样（即，通过试样图案化工艺制备的具有三种不同表面形态的三种晶体取向的试样）的拉伸测试表明，表面形态的改善使平均拉伸强度加倍：例如，在每种制造条件下，110 MPa的抗拉强度从1.8 GPa变化到3.6 GPa，而晶体取向之间的平均抗拉强度差异小于20%。利用扫描电镜观察，我们发现了三种晶向的拉伸断裂特征：在1000 μ m试样中，断裂起始位置随加工条件的变化而变化，而1100 μ m和1111 μ m试样分别显示了不同加工条件下共同的表面形貌与拉伸强度之间的定量关系。
We report the effects of surface damage and crystal orientations on fracture strength of single crystal silicon. Tensile tests of nine types of specimens from (110) SOI wafer, i.e. specimens of three crystal orientations with three different surface morphologies prepared by the specimen patterning process, showed that surface morphology improvement doubled average tensile strength: e.g. 〈110〉 strength varied from 1.8 GPa to 3.6 GPa, while average tensile strength difference among crystal orientations was less than 20 % on each fabrication conditions. Using SEM observation, we found tensile fracture characteristics of three crystal orientations: in 〈100〉 specimens the fracture origin location changed by the fabrication conditions, while 〈110〉 and 〈111〉 specimens respectively showed quantitative relationships between surface morphology and tensile strength common to different fabrication conditions.