Numerical study on laminar convective heat transfer enhancement of microencapsulated phase change material slurry using liquid metal with low melting point as carrying fluid
Numerical study on laminar convective heat transfer enhancement of microencapsulated phase change material slurry using liquid metal with low melting point as carrying fluid
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DOI：
10.1016/j.ijheatmasstransfer.2013.03.013
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发表时间：
2013-07
影响因子：
5.2
通讯作者：
Si-hong Song;Q. Liao;W. Shen;Ruan Yu;Jiafeng Xu-
中科院分区：
文献类型：
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作者：
Si-hong Song;Q. Liao;W. Shen;Ruan Yu;Jiafeng Xu-
以低熔点液态金属为载流介质（MEPCM-LM浆料）在恒热流密度管中进行了微胶囊化相变材料浆料的层流强化换热数值研究。采用有效比热容模型，考虑轴向热传导不可忽视，详细分析了各因素对强化传热的影响。此外，还比较了MEPCM- lm浆料与以水为载液的MEPCM浆料（MEPCM- water slurry）的传热能力。研究发现，体斯特凡数和MEPCM浓度是影响MEPCM- lm料浆强化传热的最重要参数。传热强化程度随体积斯特凡数、无量纲初始过冷和（或）无量纲相变温度范围的减小而增大，随质量浓度的增大而增大。传热强化程度峰值随Re的增大而减小，MEPCM-LM浆料的传热能力优于MEPCM-Water浆料，且随着x/r0的减小，两种浆料的传热能力差值增大，因此MEPCM-LM浆料更有利于切屑在狭窄空间内的散热。
The laminar convective heat transfer enhancement of microencapsulated phase change material slurry using liquid metal with low melting point as carrying fluid (MEPCM-LM slurry) in a tube with constant heat flux has been investigated numerically. The influence of each factor affecting the heat transfer enhancement was analyzed in detail by using an effective specific heat capacity model and considering axial heat conduction to be not neglected. Furthermore, the heat transfer ability of MEPCM-LM slurry was compared with that of MEPCM slurry using water as carrying fluid (MEPCM-Water slurry). It is found that bulk Stefan number and MEPCM concentration are the most important parameters influencing the heat transfer enhancement of MEPCM-LM slurry. The degrees of heat transfer enhancement increase with decreasing bulk Stefan number, dimensionless initial supercooling and/or dimensionless phase change temperature range, and increase with increasing mass concentration. The peak of the degree of heat transfer enhancement decreases with increasing Re. Moreover, the heat transfer ability of MEPCM-LM slurry is better than that of MEPCM-Water slurry, and the difference of the heat transfer ability for two slurries increases with decreasing x/r0, therefore, it is more advantageous to heat dispersion of chip in narrow space for MEPCM-LM slurry.