Thermodynamic evaluation of the liner and barrier properties of a single-phase interlayer for advanced Cu interconnections
Thermodynamic evaluation of the liner and barrier properties of a single-phase interlayer for advanced Cu interconnections
复制标题
先进铜互连单相中间层的衬垫和阻挡性能的热力学评估
DOI：
10.1109/iitc51362.2021.9537369
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发表时间：
2021
期刊：
影响因子：
--
通讯作者：
and J.Koike
中科院分区：
文献类型：
--
作者：
Y. Yamada;M.Yahagi;and J.Koike
由于Ta/TaN双金属层较厚，Cu互连线将面临电阻率的快速增加。在本文中，我们提出了一个单一的中间层具有衬垫和屏障的双重功能，以取代Ta/TaN。采用热力学模拟方法探索合适的中间层材料。材料选择的关键参数包括T0曲线，Cu与中间层的不相容性，以及中间层与SiO2之间的界面反应。结果证实了Co-Zr和Co-Ti合金是我们以前工作中实验报告的潜在中间层候选者。
Cu interconnection would face rapid increase in resistivity due to the thick double layer of Ta/TaN. In this paper, we propose a single interlayer having dual function of liner and barrier to replace Ta/TaN. Thermodynamic simulation was employed to explore suitable interlayer materials. Key parameters for material selections included T0curve, Cu immiscibility with the interlayer, and interface reaction between the interlayer and SiO2. The results confirmed Co–Zr and Co–Ti alloys to be potential candidates for the interlayer as experimentally reported in our previous work.