Path-independent integrals for heat conduction analysis in electrothermal crack problems
Path-independent integrals for heat conduction analysis in electrothermal crack problems
复制标题
电热裂纹问题中热传导分析的路径无关积分
DOI：
10.1080/01495739208946121
复制
发表时间：
1992
期刊：
影响因子：
--
通讯作者：
H. Abé
中科院分区：
文献类型：
--
作者：
M. Saka;H. Abé
本文讨论了二维双曲裂纹问题。分析了均匀各向同性导电材料在稳态直流电流作用下裂纹边缘的稳态温度分布。本文新引入了一个与路径无关的积分jt，并与作者为电裂纹问题引入的je积分一起用于分析。基于分析，模式它的应力强度因子KII，这是由于焦耳加热引起的热应力，示出是一个函数的两个路径无关的积分。
Two-dimensional electrothermal crack problems are treated. Steady temperature distribution near the lip of a crack is analyzed for a homogeneous isotropic conductive material with the steady dc current. A path-independent integral jt is newly introduced and is used for the analysis together with the je integral, which has been introduced by the authors for electric crack problems. Based on the analysis, the mode it stress intensity factor KII, which is attributed to thermal stresses caused by Joule heating, is shown to be a function of the two path-independent integrals.