Monolithic Integrated Antennas

Monolithic Integrated Antennas
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单片集成天线

DOI:
10.1002/9780470742969.ch8
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发表时间:
2009
期刊:
2019 56th ACM/IEEE Design Automation Conference (DAC)
影响因子:
--
通讯作者:
A. Rydberg
A. Rydberg
中科院分区:
--
文献类型:
--
作者:
E. Öjefors;A. Rydberg

文献摘要

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预计毫米波(mmWave)无线电前端将在未来的许多低成本消费应用中变得重要。24.05-24.25 GHz以及59-64 GHz工业、科学和医疗(ISM)频段对短距离通信特别感兴趣,而77 GHz和94 GHz频段主要针对雷达应用。然而,到目前为止,无线电前端组件的高成本限制了毫米波技术在定向无线电链路或远距离雷达等专业应用中的使用。在这些应用程序中,设计目标通常是系统性能。因此,低损耗封装技术通常与波导技术和高度定向天线(如抛物面天线)一起使用。对于即将推出的采用毫米波技术的低成本消费产品的设计,有一组不同的要求。大多数可预见的通信应用将是短距离类型,例如室内计算机网络或视听娱乐系统中取代电缆的无线电连接。虽然性能不如III-V型电路,但硅和硅锗(SiGe)半导体技术制造的毫米波电路越来越多地被使用,因为它们提供更低的制造成本以及与支持的低频和数字电路更好的集成。在目标应用中,低指向性天线,如简单的偶极子或贴片辐射器通常是足够的,因为低天线增益可以在链路预算中容纳。简单的低指向性辐射器还有助于避免在没有使用波束导向的移动通信场景中发生的指向损失。毫米波无线电前端的封装和组装目前是整个产品的重要成本。因此,在单个半导体芯片上集成所有高频元件有可能将收发器单元的价格降低到大众市场应用可接受的水平。单片集成前端几乎不需要什么
It is expected that millimeter-wave (mmWave) radio front-ends will become important in a number of low-cost consumer applications in the future. The license exempt 24.05–24.25 GHz as well as the 59–64 GHz industrial, scientific and medical (ISM) frequency bands are of particular interest for short-range communication while the 77 GHz and 94 GHz bands are primarily targeted by radar applications. However, the high cost of the radio front-end components has so far limited the use of mmWave technology to professional applications such as directional radio links or long distance radars. In these applications the design objective is usually system performance. Hence, low-loss packaging techniques are commonly used together with waveguide technology and highly directive antennas such as parabolic dishes.A different set of requirements applies for the design of the upcoming low-cost consumer products employing mmWave technology. Most of the foreseen communication applications will be of the short-range type, such as indoor computer networks or cable-replacing radio links in audio-visual entertainment systems. Although not performing as well as their III-V counterparts, mmWave circuits manufactured in silicon and silicon germanium (SiGe) semiconductor technologies are increasingly used, since they offer lower manufacturing costs as well as better integration with the supporting low frequency and digital circuits. In the targeted applications, low-directivity antennas such as simple dipole or patch radiators are often sufficient, since low-antenna gain can be accommodated in the link budgets. Simple, low-directivity radiators also help to avoid the pointing losses which would occur in a mobile communication scenario if no beam-steering is used. Packaging and assembly of the mmWave radio front-end is currently a significant cost of the total product. Hence, monolithic integration of all high-frequency components on a single semiconductor chip has the potential of lowering the price of transceiver units to a level acceptable for mass market applications. Monolithic integrated front-ends would require little