Monolithic Integrated Antennas
Monolithic Integrated Antennas
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单片集成天线
DOI:
10.1002/9780470742969.ch8
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发表时间:
2009
期刊:
影响因子:
--
通讯作者:
A. Rydberg
中科院分区:
文献类型:
--
作者:
E. Öjefors;A. Rydberg
It is expected that millimeter-wave (mmWave) radio front-ends will become important in a number of low-cost consumer applications in the future. The license exempt 24.05–24.25 GHz as well as the 59–64 GHz industrial, scientific and medical (ISM) frequency bands are of particular interest for short-range communication while the 77 GHz and 94 GHz bands are primarily targeted by radar applications. However, the high cost of the radio front-end components has so far limited the use of mmWave technology to professional applications such as directional radio links or long distance radars. In these applications the design objective is usually system performance. Hence, low-loss packaging techniques are commonly used together with waveguide technology and highly directive antennas such as parabolic dishes.A different set of requirements applies for the design of the upcoming low-cost consumer products employing mmWave technology. Most of the foreseen communication applications will be of the short-range type, such as indoor computer networks or cable-replacing radio links in audio-visual entertainment systems. Although not performing as well as their III-V counterparts, mmWave circuits manufactured in silicon and silicon germanium (SiGe) semiconductor technologies are increasingly used, since they offer lower manufacturing costs as well as better integration with the supporting low frequency and digital circuits. In the targeted applications, low-directivity antennas such as simple dipole or patch radiators are often sufficient, since low-antenna gain can be accommodated in the link budgets. Simple, low-directivity radiators also help to avoid the pointing losses which would occur in a mobile communication scenario if no beam-steering is used. Packaging and assembly of the mmWave radio front-end is currently a significant cost of the total product. Hence, monolithic integration of all high-frequency components on a single semiconductor chip has the potential of lowering the price of transceiver units to a level acceptable for mass market applications. Monolithic integrated front-ends would require little