Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder
Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder
复制标题
DOI：
10.1007/s10854-013-1490-x
复制
发表时间：
2013-09
期刊：
影响因子：
--
通讯作者：
Yanxia Jing;G. Sheng;Zhenhua Huang;Guoji Zhao
中科院分区：
文献类型：
--
作者：
Yanxia Jing;G. Sheng;Zhenhua Huang;Guoji Zhao
研究了添加0.1wt%Ni和快速凝固工艺对Sn-9 Zn钎料合金性能的影响。分析了Sn-9 Zn-0.1Ni合金与凝固态Sn-9 Zn合金的组织特征。比较研究了这两种钎料制备的钎料/Cu接头的力学性能和界面微观结构。与凝固态Sn-9 Zn合金相比，0.1wt%Ni的加入明显改善了钎料的润湿性，钎料的快速凝固过程促进了钎料的熔化行为。凝固态和快速凝固态Sn-9 Zn-0.1Ni合金的耐蚀性均有所提高，这主要是由于Ni-Zn金属间化合物（IMC）的形成和富Zn相的细化。Sn-9 Zn-0.1Ni/Cu接头界面IMC的形成和生长受到明显抑制。快速凝固工艺促进了钎焊过程中的界面反应，提高了接头的结合强度。
Effects of 0.1 wt% Ni addition and rapid solidification process on Sn–9Zn solder alloy were investigated. Characteristics of Sn–9Zn–0.1Ni alloy were analyzed compared with those of as-solidified Sn–9Zn alloy. Mechanical properties and interfacial microstructure of solder/Cu joints obtained using these solders were comparatively studied. By comparison with as-solidified Sn–9Zn alloy, the wettability of solder was obviously improved with 0.1 wt% Ni addition, and the melting behavior of the solder was promoted due to the rapid solidification process. The corrosion resistance of as-solidified and rapidly solidified Sn–9Zn–0.1Ni alloys was improved due to the formation of Ni–Zn intermetallic compound (IMC) and the refining of Zn-rich phases. Formation and growth of IMCs at the interface of Sn–9Zn–0.1Ni/Cu joints was significantly depressed. Rapid solidification process promoted the interfacial reaction during soldering and improved the bonding strength of joints.