CMOS integrated silicon/glass-bonded 3D force/torque sensor
CMOS integrated silicon/glass-bonded 3D force/torque sensor
复制标题
CMOS 集成硅/玻璃粘合 3D 力/扭矩传感器
DOI：
10.1109/memsys.2012.6170112
复制
发表时间：
2012
期刊：
影响因子：
--
通讯作者：
O. Paul
中科院分区：
文献类型：
--
作者：
J. Handwerker;P. Gieschke;M. Baumann;O. Paul
本文报道了一种小型化三维力/扭矩（3D-FT）传感器的设计，加工和表征，其负载范围为10 N和50 Nmm。该传感器由一个CMOS传感器芯片和一个牢固连接的图案化Pyrex帽组成，总尺寸仅为4 × 3 × 1.5 mm 3。该装置有两种设计，一个或四个对称放置的职位。帽通过晶片级阳极键合或使用Cytop进行单芯片处理的粘合剂键合进行连接。它将机械应力集中在Pyrex柱周围的CMOS芯片表面。通过三维有限元（FE）模拟确定了应力传感器的位置，以实现对所有六种可能载荷的最大灵敏度和选择性。任意的三维力和扭矩组合的成功测量证明。
This paper reports on the design, processing, and characterization of a miniaturized three-dimensional force/torque (3D-FT) sensor with a load range of 10 N and 50 Nmm. The sensor consists of a CMOS sensor chip with a firmly attached, patterned Pyrex cap and a total size of only 4 × 3 × 1.5 mm3. The device is available in two designs with either one or four symmetrically placed posts. The cap is attached either by anodic bonding at the wafer level or by adhesive bonding using Cytop for single-chip processing. It concentrates the mechanical stress in the surface of the CMOS chip around the Pyrex posts. Locations of the stress sensors for maximum sensitivity and selectivity with respect to all six possible loads were determined by 3D finite-element (FE) simulations. The successful measurement of arbitrary 3D force and torque combinations is demonstrated.