Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn–Cu/Ni solder joint
Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn–Cu/Ni solder joint
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DOI：
10.1016/j.jallcom.2005.03.124
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发表时间：
2006-05
影响因子：
6.2
通讯作者：
Jeong-Won Yoon;Sang-Won Kim;Seung-Boo Jung
中科院分区：
文献类型：
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作者：
Jeong-Won Yoon;Sang-Won Kim;Seung-Boo Jung
研究了不同回流和冷却条件下共晶 Sn-Cu 焊料与 Ni 基体之间的界面反应和金属间化合物 (IMC) 的形貌变化。焊料和 Ni 层之间的反应导致界面处形成 (Cu,Ni)6Sn5IMC。回流和冷却条件改变了界面处形成的IMC的形态。在低温（≤255℃）下，仅形成具有六角形截面的针状（Cu,Ni）6Sn5IMC。另一方面，随着回流温度和时间的增加，(Cu,Ni)6Sn5IMC的形貌从针状变为十二面体状。 (Cu,Ni)6Sn5IMC的形貌也受到冷却条件的影响。尽管 IMC 的形态随回流和冷却条件而变化，但这些 IMC 具有相似的化学成分。
The interfacial reaction and morphology change of intermetallic compound (IMC) between eutectic Sn–Cu solder and Ni substrate under various reflow and cooling conditions were investigated. The reaction between the solder and Ni layer resulted in the formation of (Cu,Ni)6Sn5IMC at the interface. Reflow and cooling conditions changed the morphology of the IMCs formed at the interface. At low temperatures (≤255°C), only a needle-type (Cu,Ni)6Sn5IMC with a hexagonal cross-section was formed. On the other hand, the morphology of the (Cu,Ni)6Sn5IMC changed from needle-type to dodecahedron-type with increasing reflow temperature and time. The morphology of the (Cu,Ni)6Sn5IMC was also affected by cooling condition. Even though the morphology of the IMC changed with the reflow and cooling conditions, these IMCs had a similar chemical composition.