Self-assembled silicon networks on plastic
Self-assembled silicon networks on plastic
复制标题
塑料上自组装硅网络
DOI：
10.1109/sensor.2005.1496615
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发表时间：
2005
期刊：
影响因子：
--
通讯作者：
B. Parviz
中科院分区：
文献类型：
--
作者：
S. Stauth;B. Parviz
我们展示了使用自组装的塑料基板上的微加工硅元件的低温集成。我们的方法允许不兼容的微加工技术制成的部件集成到一个单一的平台。自组装在单个步骤中进行，提供机械和电连接。温和的自组装条件（温度<100 ℃，pH /spl sim/3.5）与大多数电子和光子组件兼容。
We demonstrate the use of self-assembly for low temperature integration of microfabricated silicon components on a plastic substrate. Our method allows for integration of parts made by incompatible microfabrication technologies into a single platform. The self-assembly is performed in a single step providing both mechanical and electrical connections. The mild self-assembly conditions (temperature <100 C, pH /spl sim/3.5) are compatible with most electronics and photonics components.