Advanced Transfer Printing With In-Situ Optical Monitoring for the Integration of Micron-Scale Devices
Advanced Transfer Printing With In-Situ Optical Monitoring for the Integration of Micron-Scale Devices
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DOI：
10.1109/jstqe.2022.3227340
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发表时间：
2023-05-01
影响因子：
4.9
通讯作者：
Strain, Michael J.
中科院分区：
文献类型：
--
作者：
Guilhabert, Benoit;Bommer, Sean P.;Strain, Michael J.
平面薄膜器件在光子和电子电路上的转移印刷集成正在成为一项成熟的技术。典型的系统包括印刷成与主衬底完全接触的单个平面层。在这项工作中，我们提出了一种先进的转移打印系统，该系统能够打印非平面几何形状的光学设备，并允许对设备进行现场光学监控。我们展示了具有耦合到片上波导的空气包裹的耳语走廊模式的微谐振器、倒置器件打印以及结合半导体微透镜和纳米线激光器的三维组装的微腔。我们演示了在非标准基板上进行打印，包括光学芯片面和单模光纤端面。光纤打印是在通过转印系统的原位光学耦合的对准辅助下实时进行的，从而允许系统的主动对准。
Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.