3-D Finite Element Monte Carlo Simulations of Scaled Si SOI FinFET With Different Cross Sections
3-D Finite Element Monte Carlo Simulations of Scaled Si SOI FinFET With Different Cross Sections
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DOI:
10.1109/tnano.2014.2367095
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发表时间:
2015
影响因子:
2.4
通讯作者:
D. Nagy;M. Elmessary;M. Aldegunde;R. Valin;A. Martinez;J. Lindberg;W. Dettmer;D. Peric;A. García-Loureiro;K. Kalna
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文献类型:
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作者:
D. Nagy;M. Elmessary;M. Aldegunde;R. Valin;A. Martinez;J. Lindberg;W. Dettmer;D. Peric;A. García-Loureiro;K. Kalna
Nanoscaled Si SOI FinFETs with gate lengths of 12.8 and 10.7 nm are simulated using 3-D finite element Monte Carlo (MC) simulations with 2-D Schrodinger-based quantum corrections. These nonplanar transistors are studied for two cross sections: rectangular-like and triangular-like, and for two channel orientations: (100) and (110). The 10.7-nm gate length rectangular-like FinFET is also simulated using the 3-D nonequilibrium Green's functions (NEGF) technique and the results are compared with MC simulations. The 12.8 and 10.7 nm gate length rectangular-like FinFETs give larger drive currents per perimeter by about 33- 37% than the triangular-like shaped but are outperformed by the triangular-like ones when normalised by channel area. The devices with a (100) channel orientation deliver a larger drive current by about 11% more than their counterparts with a (110) channel when scaled to 12.8 nm and to 10.7 nm gate lengths. ID - VG characteristics obtained from the 3-D NEGF simulations show a remarkable agreement with the MC results at low drain bias. At a high drain bias, the NEGF overestimates the on-current from about VG - VT = 0.3 V because the NEGF simulations do not include the scattering with interface roughness and ionized impurities.