Strength of joints produced by transient liquid phase bonding in the Cu-Sn system
Strength of joints produced by transient liquid phase bonding in the Cu-Sn system
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DOI：
10.1016/j.actamat.2005.01.013
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发表时间：
2005-04-01
期刊：
影响因子：
9.4
通讯作者：
Zok, FW
中科院分区：
文献类型：
--
作者：
Bosco, NS;Zok, FW
本文重点研究 Cu-Sn 体系中瞬态液相 (TLP) 键合产生的接头的强度和韧性。它的动机是 TLP 键合在将高温宽带隙器件附着到陶瓷基板上的潜在应用。利用氧化物弥散强化铜基材，开发了适合机械测试的模型测试样本。探讨了三种微观结构条件：均匀的 δ 金属间相 (Cu41Sn11) 层、包含 δ 相和延性 (Cu) 颗粒分散体的两相微观结构以及均匀的 Cu 固溶体。有缺口和无缺口弯曲测试用于确定强度和韧性。 δ相表现出相当高的强度（300 MPa），但韧性较低（5 MPa root·m）。添加 (Cu) 颗粒可使强度和韧性提高约 30%（分别为 400 MPa 和 7 MPa root m）。这些性能的增强是在现有的韧性相增韧模型的基础上合理化的。金属间化合物向Cu固溶体的转化导致强度降低（至200 MPa），但韧性增加（至13 MPa root·m）。后一种趋势似乎是接头材料流动应力降低的结果。此外，向 (Cu) 的转化伴随着空隙的形成，主要是在 δ 相和相邻 Cu 之间的先前边界附近。相对于无缺陷铜固溶体的内在价值，空隙可能会降低接头性能。 (c) 2005 Acta Materialia Inc. 由 Elsevier Ltd 出版。保留所有权利。
The paper focuses on the strength and toughness of joints produced by transient liquid phase (TLP) bonding in the Cu-Sn system. It is motivated by potential applications of TLP bonding in attachment of high-temperature wide bandgap devices to ceramic substrates. Model test specimens suitable for mechanical testing are developed, utilizing substrates of oxide dispersion strengthened copper. Three microstructural conditions are probed: a uniform layer of the delta intermetallic phase (Cu41Sn11), a two-phase microstructure comprising the delta-phase and a dispersion of ductile (Cu) particles, and a uniform Cu solid solution. Notched and unnotched bend tests are used to ascertain strength and toughness. The delta-phase exhibits a reasonably high strength (300 MPa), but low toughness ( 5 MPa root m). Addition of (Cu) particles increases both the strength and the toughness by about 30% (400 MPa and 7 MPa root m, respectively). These property enhancements are rationalized on the basis of existing models of ductile phase toughening. The conversion of the intermetallic to Cu solid solution leads to a decrease in strength (to 200 MPa), but an increase in toughness (to 13 MPa root m). The latter trends appear to be a consequence of the reduction in the flow stress of the joint material. Additionally, the conversion to (Cu) is accompanied by the formation of voids, predominantly near the prior boundary between the delta-phase and the adjoining Cu. The voids likely diminish the joint properties, relative to the intrinsic values associated with the defect-free copper solid solution. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.