Planar Power Module With Low Thermal Impedance and Low Thermomechanical Stress
Planar Power Module With Low Thermal Impedance and Low Thermomechanical Stress
复制标题
具有低热阻和低热机械应力的平面电源模块
DOI：
10.1109/tcpmt.2012.2196799
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发表时间：
2012
期刊：
影响因子：
--
通讯作者：
K. Ngo
中科院分区：
文献类型：
--
作者：
Xiao Cao;G. Lu;K. Ngo
近年来，提高电源模块功率密度的需求日益增长。因此，电源模块的热管理变得越来越关键。在本文中，我们表明，采用引线键合连接的传统单面功率模块在高传热系数条件下无法同时实现良好的稳态和瞬态热性能。已提出板接合功率模块来解决这个问题。然而，功率模块中嵌入的厚铜板在温度循环过程中会产生较大的热机械应力，导致可靠性较差。为了在不显着影响热性能的情况下减少热机械应力，设计并提出了一种沟槽铜板功率模块。参数研究表明，如果将单块铜板替换为3×3沟槽铜板，焊料层的最大von Mises应力和塑性应变可分别降低18.7%和67.8%。
In recent years, there has been growing demand to increase the power density in power modules. Therefore, the thermal management of power modules has become more and more critical. In this paper, we show that conventional single-sided power module with wire-bond connection cannot achieve both good steady-state and transient thermal performance under high heat transfer coefficient conditions. The plate-bonded power module has been proposed to resolve this issue. However, the thick copper plate embedded in the power module induces large thermomechanical stress during temperature cycling, leading to poor reliability. To reduce the thermomechanical stress without significantly compromising the thermal performance, a trenched copper plate power module is designed and presented. A parametric study shows that the maximum von Mises stress and plastic strain in the solder layer can be reduced by 18.7%, and 67.8%, respectively, if the single piece of copper plate is replaced by a 3 × 3 trenched copper plate.